Leetop-FLAME-TX2NX is an embedded artificial intelligence computer capable of empowering many end devices with up to 21TOPS of computing power. leetop-FLAME-NX offers a fast passive thermal design that can meet industrial standards such as anti-vibration and anti-static. Meanwhile, Leetop-FLAME-NX is rich in interfaces and cost-effective.

Technical Specifications

AI Performance



NVIDIA Pascal architecture with 256 NVIDIA® CUDA® cores


Dual-core NVIDIA Denver 2 64-bit CPU and quad-core Arm® Cortex®-A57 MPCore processor complex


4 GB 128-bit LPDDR4
51.2 GB/s


16 GB eMMC 5.1


7.5W | 15W


1 x1 + 1 x2
PCIe Gen2, total 30 GT/s

CSI Camera

Up to 5 cameras (12 via virtual channels)
12 lanes MIPI CSI-2 (3x4 or 5x2)
D-PHY 1.2 (up to 30 Gbps)

Video Encode

1x 4K60 | 3x 4K30 | 4x 1080p60 | 8x 1080p30 (H.265)
1x 4K60 | 3x 4K30 | 7x 1080p60 | 14x 1080p30 (H.264)

Video Decode

2x 4K60 | 4x 4K30 | 7x 1080p60 | 14x 1080p30 (H.265 & H.264)


2 multi-mode DP 1.2/eDP 1.4/HDMI 2.0
1x 2 DSI (1.5Gbps/lane)


10/100/1000 BASE-T Ethernet


69.6 mm x 45 mm
260-pin SO-DIMM edge connector

接口 I/O

接口 Interface 规格 Specification
网络接口 Network 2 x Gigabit Ethernet Connector (10/100/1000)
视频输出 Video Output 2 x HDMI 2.0 (TYPE A)
音频接口 Audio 1 x Audio Jack (3.5mm)
USB 4 x USB 3.0 (TYPE A) + 1 x USB-OTG (Type C)
TF卡座 TF Slot 1 x TF Card Slot
按键 Function Keys 1 x Reset Button + 1 x Recovery Button
Hard Disk 2.5" hard drive (SATA) x 1
Serial port (Optional) RS232 x 1 (2) / RS485 x 1 (2) / 1X SPI Bus(+3.3V Level) / 1x CAN /2x I2C Link(+3.3V I/O) 1x UART(+3.3V Level) / 1X SPI Bus(+3.3V Level) / 2x GPIO(+3.3V Level)

供电 Power Supply

Power Supply Specification
Input Type DC
Input Voltage +13V(8A) ~ +24V(5A)
Typical consumption 30W

结构 Mechanical

Mechanical Specification
Dimensions (W x H x D) 209.0mm x 68.3mm x 130.0mm
Weight 1.5kg

环境 Environmental

Environmental Specification
Operating Temperature -20℃-60℃, 0.2~0.3m/s air flow
Storage Temperature -25℃ ~ +80℃
Storage Humidity 10%-90% 非结露环境 non-condensing

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